DocumentCode :
912853
Title :
Finite-Element Simulation of Local Oxidation of Silicon
Author :
Poncet, Alain
Author_Institution :
Centre National d´´Etudes des Telecommunications (CNET) BP 42, 38240 Meylan, France.
Volume :
4
Issue :
1
fYear :
1985
fDate :
1/1/1985 12:00:00 AM
Firstpage :
41
Lastpage :
53
Abstract :
In this paper, various numerical models for finite element simulation of local oxidation of silicon are investigated. The simplest one contains linear diffusion of oxidizing species and elastic displacements of dioxide layers. The limitations of this model and the influences of pad-oxide and nitride mask thicknesses as well as temperature are illustrated by computer simulations. The local effects of mechanical stresses on the diffusion mechanism are simulated and an elasto-visco-plastic model is proposed so that a wide range of temperatures can be covered. Finite-Element simulation of semi-Rox, full-Rox, and SILO processes are presented.
Keywords :
Computational modeling; Computer simulation; Finite element methods; Insulation; Numerical models; Oxidation; Silicon on insulator technology; Stress; Temperature; Viscosity;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.1985.1270097
Filename :
1270097
Link To Document :
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