DocumentCode
914669
Title
Thermodynamic Optimization of Block Placement
Author
Siarry, Patrick ; Bergonzi, Ludovic ; Dreyfus, Gérard
Author_Institution
Ecole Superieure de Physique et de Chimie Industrielles de la Ville de Paris, Laboratoire d´´Electronique, Paris, France
Volume
6
Issue
2
fYear
1987
fDate
3/1/1987 12:00:00 AM
Firstpage
211
Lastpage
221
Abstract
This paper presents the results of a systematic investigation of the thermodynamic ("simulated annealing") method applied to the placement of rectangular blocks on a chip. A new presentation of the fundamental ideas underlying this technique is proposed. It is shown that the analogies with physics, which have been at the origin of the method, may be partially forgotten, but that they are still useful to understand some results. Several simple examples are investigated, and the influence of various parameters is studied. Typical complex industrial applications are subsequently presented. Finally, an interactive implementation of the thermodynamic optimization algorithm, based on the results of the present investigation, is proposed.
Keywords
Design automation; Design optimization; Glass; Integrated circuit technology; Laboratories; Mathematics; Operations research; Physics; Simulated annealing; Thermodynamics;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.1987.1270265
Filename
1270265
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