DocumentCode :
914669
Title :
Thermodynamic Optimization of Block Placement
Author :
Siarry, Patrick ; Bergonzi, Ludovic ; Dreyfus, Gérard
Author_Institution :
Ecole Superieure de Physique et de Chimie Industrielles de la Ville de Paris, Laboratoire d´´Electronique, Paris, France
Volume :
6
Issue :
2
fYear :
1987
fDate :
3/1/1987 12:00:00 AM
Firstpage :
211
Lastpage :
221
Abstract :
This paper presents the results of a systematic investigation of the thermodynamic ("simulated annealing") method applied to the placement of rectangular blocks on a chip. A new presentation of the fundamental ideas underlying this technique is proposed. It is shown that the analogies with physics, which have been at the origin of the method, may be partially forgotten, but that they are still useful to understand some results. Several simple examples are investigated, and the influence of various parameters is studied. Typical complex industrial applications are subsequently presented. Finally, an interactive implementation of the thermodynamic optimization algorithm, based on the results of the present investigation, is proposed.
Keywords :
Design automation; Design optimization; Glass; Integrated circuit technology; Laboratories; Mathematics; Operations research; Physics; Simulated annealing; Thermodynamics;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.1987.1270265
Filename :
1270265
Link To Document :
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