• DocumentCode
    914669
  • Title

    Thermodynamic Optimization of Block Placement

  • Author

    Siarry, Patrick ; Bergonzi, Ludovic ; Dreyfus, Gérard

  • Author_Institution
    Ecole Superieure de Physique et de Chimie Industrielles de la Ville de Paris, Laboratoire d´´Electronique, Paris, France
  • Volume
    6
  • Issue
    2
  • fYear
    1987
  • fDate
    3/1/1987 12:00:00 AM
  • Firstpage
    211
  • Lastpage
    221
  • Abstract
    This paper presents the results of a systematic investigation of the thermodynamic ("simulated annealing") method applied to the placement of rectangular blocks on a chip. A new presentation of the fundamental ideas underlying this technique is proposed. It is shown that the analogies with physics, which have been at the origin of the method, may be partially forgotten, but that they are still useful to understand some results. Several simple examples are investigated, and the influence of various parameters is studied. Typical complex industrial applications are subsequently presented. Finally, an interactive implementation of the thermodynamic optimization algorithm, based on the results of the present investigation, is proposed.
  • Keywords
    Design automation; Design optimization; Glass; Integrated circuit technology; Laboratories; Mathematics; Operations research; Physics; Simulated annealing; Thermodynamics;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.1987.1270265
  • Filename
    1270265