Title :
A Hierarchical Global Wiring Algorithm for Custom Chip Design
Author :
Luk, W.K. ; Sipala, Paola ; Tamminen, Marakku ; Tang, Donald ; Woo, Lin S. ; Wong, C.K.
Author_Institution :
IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA
fDate :
7/1/1987 12:00:00 AM
Abstract :
We present a global wiring algorithm used in a top-down physical design environment, i.e., macros are laid out after global wiring is done, and wires are allowed to pass through macros (the wiring-through model). The floorplan of the chip is in the form of a slicing structure. The algorithm is based on a hierarchical scheme. The final result is obtained through a series of refinement as the problem is recursively decomposed into a set of small-sized problems and then solved efficiently. The worst-case run-time for an arbitrary slicing tree (totally skewed) is O(M 2 N). When the floorplan is represented by a balanced slicing tree, the run-time of the overall algorithm is O(MN), where M is the number of macros and N the number of nets. The algorithm has been implemented in the C language and is used for chip designs. Experiments on both real and randomly generated designs show that the hierarchical router performs equally well as a flat global router in terms of wire length and wireability handling, but much faster in run-time (at least 10 times for an example with 100 macros and 1000 nets, and the gap being even larger for bigger-size problems).
Keywords :
Global wiring; Steiner tree; VLSI algorithm; VLSI physical design; slicing floorplan; Algorithm design and analysis; Chip scale packaging; Circuits; Large scale integration; Logic design; Partitioning algorithms; Runtime; Very large scale integration; Wires; Wiring;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.1987.1270300