• DocumentCode
    915060
  • Title

    Influence of temperature on mechanical and insulation properties of epoxy-layered silicate nanocomposite

  • Author

    Imai, Takahiro ; Sawa, Fumio ; Ozaki, Tamon ; Shimizu, Toshio ; Kido, Ryouichi ; Kozako, Masahiro ; Tanaka, Toshikatsu

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Tokyo, Japan
  • Volume
    13
  • Issue
    2
  • fYear
    2006
  • fDate
    4/1/2006 12:00:00 AM
  • Firstpage
    445
  • Lastpage
    452
  • Abstract
    The aim of this study is to investigate the influence of temperature on the mechanical and insulation properties of a newly developed epoxy-layered silicate nanocomposite. This nanocomposite has a higher thermal resistance with respect to mechanical properties than a base epoxy resin (epoxy resin without fillers). The volume resistivity of the nanocomposite gradually decreases with increasing temperature, and its relative permittivity gradually increases with increasing temperature. Its properties are more dependent on temperature than those of the base epoxy resin. Moreover, under a constant AC voltage, the insulation breakdown time of the nanocomposite was twice as long as that of the base epoxy resin at 20 /spl deg/C and six times as long at 80 /spl deg/C. In particular, at 145 /spl deg/C, the nanocomposite had a breakdown time of more than 20,000 minutes while the base epoxy resin had breakdown time of 280 minutes. This improvement in breakdown time resulted from electrical treeing shapes with many branches and smaller internal stress of the nanocomposite in comparison with the base epoxy resin.
  • Keywords
    epoxy insulation; filled polymers; internal stresses; nanocomposites; permittivity; thermal resistance; trees (electrical); electrical treeing; epoxy resin; epoxy-layered silicate nanocomposite; insulation breakdown; insulation properties; internal stress; mechanical properties; nanofiller; permittivity; thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2006.1624291
  • Filename
    1624291