VLSI reliability in Europe

Author

Verweij, Jan F.

Author_Institution

Fac. of Electr. Eng., Twente Univ., Enschede, Netherlands

Volume

81

Issue

5

fYear

1993

fDate

5/1/1993 12:00:00 AM

Firstpage

675

Lastpage

681

Abstract

Several issue´s regarding VLSI reliability research in Europe are discussed. Organizations involved in stimulating the activities on reliability by exchanging information or supporting research programs are described. Within one such program, ESPRIT, a technical interest group on IC reliability was formed to formulate particular needs and necessary improvements in education and research. In addition to ESPRIT research projects, there are smaller projects on reliability subjects. Two examples, one dealing with plastic-encapsulation and the other with electrostatic discharge, are treated in some detail. Some achievements in the areas of oxide breakdown and plastic encapsulated ICs in temperature cycling are also presented. A few opinions are offered on trends in reliability engineering, including reliability circuit simulation

Keywords

VLSI; circuit reliability; electrostatic discharge; encapsulation; integrated circuit technology; packaging; research initiatives; ESD; ESPRIT research projects; Europe; IC reliability; VLSI reliability; electrostatic discharge; oxide breakdown; plastic-encapsulation; reliability circuit simulation; reliability engineering; research programs; temperature cycling; Circuit simulation; Educational programs; Electric breakdown; Europe; Plastic packaging; Production; Reliability engineering; Standardization; Temperature; Very large scale integration;

fLanguage

English

Journal_Title

Proceedings of the IEEE

Publisher

ieee

ISSN

0018-9219

Type

jour

DOI

10.1109/5.220899

Filename

220899