Title :
IC failure analysis: techniques and tools for quality reliability improvement
Author :
Soden, Jerry M. ; Anderson, Richard E.
Author_Institution :
Sandia Nat. Lab., Albuquerque, NM, USA
fDate :
5/1/1993 12:00:00 AM
Abstract :
The role of failure analysis is discussed. Failure analysis techniques and tools, including electrical measurements, optical microscopy, thermal imaging analysis, electron beam techniques, light emission microscopy, ion beam techniques, and scanning probe microscopy, are reviewed. Opportunities for advances in the field of IC failure analysis are considered
Keywords :
circuit reliability; electron beam testing; failure analysis; infrared imaging; integrated circuit manufacture; integrated circuit technology; integrated circuit testing; ion beam applications; optical microscopy; production testing; quality control; reviews; IC failure analysis; electrical measurements; electron beam techniques; ion beam techniques; light emission microscopy; optical microscopy; scanning probe microscopy; thermal imaging analysis; Electric variables measurement; Electron beams; Electron optics; Failure analysis; Image analysis; Optical imaging; Optical microscopy; Particle beam optics; Scanning electron microscopy; Stimulated emission;
Journal_Title :
Proceedings of the IEEE
