DocumentCode
915846
Title
IC failure analysis: techniques and tools for quality reliability improvement
Author
Soden, Jerry M. ; Anderson, Richard E.
Author_Institution
Sandia Nat. Lab., Albuquerque, NM, USA
Volume
81
Issue
5
fYear
1993
fDate
5/1/1993 12:00:00 AM
Firstpage
703
Lastpage
715
Abstract
The role of failure analysis is discussed. Failure analysis techniques and tools, including electrical measurements, optical microscopy, thermal imaging analysis, electron beam techniques, light emission microscopy, ion beam techniques, and scanning probe microscopy, are reviewed. Opportunities for advances in the field of IC failure analysis are considered
Keywords
circuit reliability; electron beam testing; failure analysis; infrared imaging; integrated circuit manufacture; integrated circuit technology; integrated circuit testing; ion beam applications; optical microscopy; production testing; quality control; reviews; IC failure analysis; electrical measurements; electron beam techniques; ion beam techniques; light emission microscopy; optical microscopy; scanning probe microscopy; thermal imaging analysis; Electric variables measurement; Electron beams; Electron optics; Failure analysis; Image analysis; Optical imaging; Optical microscopy; Particle beam optics; Scanning electron microscopy; Stimulated emission;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.220902
Filename
220902
Link To Document