DocumentCode
915859
Title
Composite IMPATT diodes for 110-GHz operation
Author
Marinaccio, L.P.
Volume
59
Issue
1
fYear
1971
Firstpage
94
Lastpage
95
Abstract
The assembly of composite silicon IMPATT diodes for 110-GHz operation with improved power-handling capability is described. Up to 140 mW CW output power at burnout was observed with a three-wafer assembly compared with 110 mW and 74 mW for the best performing double- and single-wafer units, respectively. The efficiencies were approximately 3 percent.
Keywords
Capacitance; Circuits; Clocks; Diodes; Equations; Etching; Gold; Hardware; Oscillators; Wafer bonding;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1971.8103
Filename
1450033
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