Design for reliability: the major challenge for VLSI

Author

Yang, Ping ; Chern, Jue-Hsien

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

Volume

81

Issue

5

fYear

1993

fDate

5/1/1993 12:00:00 AM

Firstpage

730

Lastpage

744

Abstract

Selected integrated circuit (IC) reliability issues are discussed within the context of the design-in reliability concept. The electrical reliability issues discussed are latchup, electrostatic discharge, hot carrier effects, thin dielectric breakdown, and electromigration. Examples of the environmental reliability issues discussed are α-particle induced soft errors, thermal stress, mechanical stress, and corrosion

Keywords

VLSI; circuit reliability; corrosion; electric breakdown of solids; electromigration; electrostatic discharge; hot carriers; integrated circuit technology; thermal stresses; α-particle induced soft errors; VLSI; corrosion; design for reliability; electrical reliability; electromigration; electrostatic discharge; environmental reliability; hot carrier effects; integrated circuit; latchup; mechanical stress; thermal stress; thin dielectric breakdown; Circuit synthesis; Computer aided manufacturing; Electrostatic discharge; Hot carrier effects; Predictive models; Product design; Qualifications; Semiconductor process modeling; Time to market; Very large scale integration;

fLanguage

English

Journal_Title

Proceedings of the IEEE

Publisher

ieee

ISSN

0018-9219

Type

jour

DOI

10.1109/5.220904

Filename

220904