Title :
Laser ablation of parallel optical interconnect waveguides
Author :
Van Steenberge, G. ; Hendrickx, N. ; Bosman, E. ; Van Erps, J. ; Thienpont, H. ; Van Daele, P.
Author_Institution :
Dept. of Inf. Technol., Ghent Univ./Interuniv. Micro-Electron. Center, Belgium
fDate :
5/1/2006 12:00:00 AM
Abstract :
Excimer laser ablation is presented as an alternative technology to photolithography for the fabrication of board-level parallel optical interconnect waveguides. Arrays of polymer multimode waveguides with a 50×50 μm2 cross section on a 125-μm pitch are fully characterized. Root mean square sidewall roughness is 35 nm; no deposition of debris is observed on scanning electron microscope images. The first conclusion out of loss spectrum measurements is a "yellowing effect" of laser ablated waveguides, leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a wavelength of 850, 980, and 1310 nm. This is verified at 850 nm by cutback measurements on 10-cm-long waveguides showing an average propagation loss of 0.13 dB/cm.
Keywords :
excimer lasers; laser ablation; optical fabrication; optical interconnections; optical polymers; optical waveguides; 10 cm; 1310 nm; 850 nm; 980 nm; excimer laser ablation; optical interconnect waveguides; photolithography; polymer multimode waveguides; yellowing effect; Laser ablation; Lithography; Loss measurement; Optical device fabrication; Optical interconnections; Optical waveguides; Polymers; Root mean square; Waveguide lasers; Wavelength measurement; Laser ablation; optical interconnect; polymer; printed circuit board (PCB); waveguide;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2006.873357