The CHIP - A Design Guide for Reducing Substrate Noise Coupling in RF Applications

Author

Helmy, Ahmed ; Ismail, Mohammed

Author_Institution

Dept. of Electr. Eng., Ohio State Univ., Columbus, OH

Volume

22

Issue

5

fYear

2006

Firstpage

7

Lastpage

21

Abstract

This article discusses a set of design guidelines to reduce the on-chip substrate noise coupling in RF and mixed signal applications. Measurement data is presented to compare the various signal isolation techniques. A design flow is calibrated to the measured data and is used to expand the design guide to include the effects of the geometrical and electrical parameters of the isolation structures as well as the frequency of operation on the isolation level. A set of guidelines is presented to the reader as a summary of the studied experiments

Keywords

integrated circuit design; integrated circuit noise; interference suppression; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; substrates; RF applications; design guide; mixed signal applications; on chip substrate noise; signal isolation; substrate noise coupling; Circuit noise; Costs; Coupling circuits; Degradation; Guidelines; Noise reduction; Packaging; Radio frequency; Silicon; Switching circuits;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/MCD.2006.272996

Filename

4049877