Title :
The CHIP - A Design Guide for Reducing Substrate Noise Coupling in RF Applications
Author :
Helmy, Ahmed ; Ismail, Mohammed
Author_Institution :
Dept. of Electr. Eng., Ohio State Univ., Columbus, OH
Abstract :
This article discusses a set of design guidelines to reduce the on-chip substrate noise coupling in RF and mixed signal applications. Measurement data is presented to compare the various signal isolation techniques. A design flow is calibrated to the measured data and is used to expand the design guide to include the effects of the geometrical and electrical parameters of the isolation structures as well as the frequency of operation on the isolation level. A set of guidelines is presented to the reader as a summary of the studied experiments
Keywords :
integrated circuit design; integrated circuit noise; interference suppression; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; substrates; RF applications; design guide; mixed signal applications; on chip substrate noise; signal isolation; substrate noise coupling; Circuit noise; Costs; Coupling circuits; Degradation; Guidelines; Noise reduction; Packaging; Radio frequency; Silicon; Switching circuits;
Journal_Title :
Circuits and Devices Magazine, IEEE
DOI :
10.1109/MCD.2006.272996
