Uniaxial-process-induced strained-Si: extending the CMOS roadmap

This paper reviews the history of strained-silicon and the adoption of uniaxial-process-induced strain in nearly all high-performance 90-, 65-, and 45-nm logic technologies to date. A more complete data set of n- and p-channel MOSFET piezoresistance and strain-altered gate tunneling is presented along with new insight into the physical mechanisms responsible for hole mobility enhancement. Strained-Si hole mobility data are analyzed using six band k·p calculations for stresses of technological importance: uniaxial longitudinal compressive and biaxial stress on [001] and [110] wafers. The calculations and experimental data show that low in-plane and large out-of-plane conductivity effective masses and a high density of states in the top band are all important for large hole mobility enhancement. This work suggests longitudinal compressive stress on [001] or [110] wafers and <110> channel direction offers the most favorable band structure for holes. The maximum Si inversion-layer hole mobility enhancement is estimated to be ∼ 4 times higher for uniaxial stress on (100) wafer and ∼ 2 times higher for biaxial stress on (100) wafer and for uniaxial stress on a [110] wafer.