• DocumentCode
    919582
  • Title

    Termination materials for thin film resistors

  • Author

    Fisher, John S. ; Hall, Peter M.

  • Author_Institution
    Bell Telephone Laboratories, Inc., Allentown, Pa.
  • Volume
    59
  • Issue
    10
  • fYear
    1971
  • Firstpage
    1418
  • Lastpage
    1424
  • Abstract
    The resistance of a thin film resistor can be considered as consisting of three parts: 1) the resistance of the resistor material, 2) the resistance of the termination material, and 3) the interfacial resistance. The aging of the interfacial resistance can dominate the aging of low valued resistors, especially under corrosive conditions. The interfacial resistance using a distributed parameter analysis is treated and a figure of merit which can be used to describe the aging of the interface is defined. Also, a sensitive method of measuring this quantity is introduced and a sampling of data on several different termination material systems is presented. The best results were obtained with Ti-Pd-Au. The conclusions drawn from the figure of merit are corroborated by adhesion and thermocompression bond strength studies.
  • Keywords
    Aging; Atmospheric measurements; Atmospheric modeling; Bonding; Electrical resistance measurement; Resistors; Sheet materials; Substrates; Testing; Transistors;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1971.8448
  • Filename
    1450378