• DocumentCode
    921101
  • Title

    A New Chip and a New Package for Higher Power

  • Author

    Cini, Carlo ; Palara, Sergio ; Seragnoli, Giordano

  • Author_Institution
    SGS-ATES Componenti Elettronici SpA
  • Issue
    1
  • fYear
    1980
  • Firstpage
    54
  • Lastpage
    72
  • Abstract
    The best of the state of the art in power handling with integrated circuits can be reached only if innova tions are introduced to both the chip and the package designs.
  • Keywords
    Bridge circuits; Chip scale packaging; Cost function; Electronics packaging; Flexible printed circuits; Integrated circuit packaging; Integrated circuit reliability; Power amplifiers; Production; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Consumer Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0098-3063
  • Type

    jour

  • DOI
    10.1109/TCE.1980.273320
  • Filename
    4050261
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=921101