Title :
A New Chip and a New Package for Higher Power
Author :
Cini, Carlo ; Palara, Sergio ; Seragnoli, Giordano
Author_Institution :
SGS-ATES Componenti Elettronici SpA
Abstract :
The best of the state of the art in power handling with integrated circuits can be reached only if innova tions are introduced to both the chip and the package designs.
Keywords :
Bridge circuits; Chip scale packaging; Cost function; Electronics packaging; Flexible printed circuits; Integrated circuit packaging; Integrated circuit reliability; Power amplifiers; Production; Thermal resistance;
Journal_Title :
Consumer Electronics, IEEE Transactions on
DOI :
10.1109/TCE.1980.273320
