DocumentCode :
921323
Title :
Use of noise thermometry to study the effects of self-heating in submicrometer SOI MOSFETs
Author :
Bunyan, R.J.T. ; Uren, M.J. ; Alderman, J.C. ; Eccleston, W.
Author_Institution :
DRA Electron Div., Malvern, UK
Volume :
13
Issue :
5
fYear :
1992
fDate :
5/1/1992 12:00:00 AM
Firstpage :
279
Lastpage :
281
Abstract :
The authors report the direct measurement of the silicon island temperature in both long and submicrometer thin-film silicon-on-insulator (SOI) MOSFETs as a function of bias conditions using noise thermometry. They show that the device island temperature increases with drain voltage and that this results in a reduction of drain current. Using standard models of the drain current and velocity/field expression, they show that a thermally induced fall in mobility quantitatively accounts for the loss in drain current drive observed.<>
Keywords :
carrier mobility; electron device noise; insulated gate field effect transistors; semiconductor-insulator boundaries; temperature distribution; temperature measurement; Si-SiO/sub 2/; bias conditions; drain current; drain voltage; island temperature; noise thermometry; self-heating; submicrometre SOI MOSFET; thermally induced mobility fall; velocity/field expression; Circuits; Electrical resistance measurement; Immune system; MOSFETs; Noise measurement; Resistors; Silicon; Temperature; Thermal resistance; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.145053
Filename :
145053
Link To Document :
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