The use of side wall images to compute package effects in MoM analysis of MMIC circuits

Author

Jackson, Robert W.

Author_Institution

Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

Volume

41

Issue

3

fYear

1993

fDate

3/1/1993 12:00:00 AM

Firstpage

406

Lastpage

414

Abstract

A formulation of the method of moments solution of shielded, enclosed microstrip MMIC circuits is presented. The technique involves first computing a circuit´s mutual impedance characteristics with no lateral enclosure and then adding a correcting term resulting from the images introduced by lateral side walls. The method is especially useful for determining the impact of low-Q package resonances in very large packages. Large lateral enclosure size does not degrade the efficiency of this technique. The importance of the TM₀ parallel-plate mode in MMIC circuit coupling is emphasized

Keywords

MMIC; electric impedance; packaging; MMIC circuits; TM₀ parallel-plate mode; circuit coupling; large packages; lateral side walls; low-Q package resonances; method of moments solution; moments method; mutual impedance characteristics; package effects; side wall images; Circuit analysis; Circuit analysis computing; Circuit simulation; Electromagnetic analysis; Image analysis; MMICs; Message-oriented middleware; Microstrip; Packaging; Resonance;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.223738

Filename

223738