Title :
The use of side wall images to compute package effects in MoM analysis of MMIC circuits
Author :
Jackson, Robert W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
fDate :
3/1/1993 12:00:00 AM
Abstract :
A formulation of the method of moments solution of shielded, enclosed microstrip MMIC circuits is presented. The technique involves first computing a circuit´s mutual impedance characteristics with no lateral enclosure and then adding a correcting term resulting from the images introduced by lateral side walls. The method is especially useful for determining the impact of low-Q package resonances in very large packages. Large lateral enclosure size does not degrade the efficiency of this technique. The importance of the TM0 parallel-plate mode in MMIC circuit coupling is emphasized
Keywords :
MMIC; electric impedance; packaging; MMIC circuits; TM0 parallel-plate mode; circuit coupling; large packages; lateral side walls; low-Q package resonances; method of moments solution; moments method; mutual impedance characteristics; package effects; side wall images; Circuit analysis; Circuit analysis computing; Circuit simulation; Electromagnetic analysis; Image analysis; MMICs; Message-oriented middleware; Microstrip; Packaging; Resonance;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
