• DocumentCode
    925905
  • Title

    Integral heat-sink IMPATT diodes fabricated using p+etch stop

  • Author

    Rhee, C. John ; Saltich, Jack

  • Author_Institution
    Central Research Laboratories, Phoenix, Ariz.
  • Volume
    61
  • Issue
    3
  • fYear
    1973
  • fDate
    3/1/1973 12:00:00 AM
  • Firstpage
    385
  • Lastpage
    386
  • Abstract
    The problems in batch fabrication of integral heat-sink IMPATT diodes are greatly simplified through a newly developed preferential etching technique. Devices fabricated utilizing the new technique have thermal resistance (θjc) values of 17-20°C/W for an active area of 2 × 10-4cm2.
  • Keywords
    Boron; Etching; Fabrication; Heat sinks; Metallization; Scanning electron microscopy; Semiconductor diodes; Silicon; Substrates; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1973.9037
  • Filename
    1450967
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=925905