• DocumentCode
    926124
  • Title

    State-of-the-art insulator and electrode materials for use in high current high energy switching

  • Author

    Donaldson, A.L. ; Engel, T.G. ; Kristiansen, M.

  • Author_Institution
    Dept. of Electr. Eng., Texas Tech. Univ., Lubbock, TX, USA
  • Volume
    25
  • Issue
    1
  • fYear
    1989
  • fDate
    1/1/1989 12:00:00 AM
  • Firstpage
    138
  • Lastpage
    141
  • Abstract
    An investigation into the failure of ceramic insulators that are used in a surface discharge switch (SDS) was conducted. The materials analyzed are Al2O3-25% SiC, MTF (modified alumina titanate), and CZA 500 (zirconia-alumina composite) ceramics. These insulators were subjected to high-current (~300 kA) surface discharges in atmospheric air and nitrogen. Energy-dispersive X-ray surface analysis was performed on the insulator surfaces in order to determine the contaminants that are present and the possible failure modes associated with the plasma arc environments mentioned above. Electrode erosion rates have been measured as a function of total charge transfer (up to 50 C/shot) for several in-situ materials including Cu-Nb, Cu-Nb+LaB6, and Cu-Ta. Results from comparisons with standard Cu and CuW materials indicate that the in-situ materials represent an efficient method of retaining the copper in the bulk until it vaporizes and thus yield significantly lower erosion rates at high Coulomb transfer rates
  • Keywords
    arcs (electric); ceramics; electrodes; insulating materials; surface discharges; switchgear; 300 kA; Al2O3-TiO2; N2; ZrO2-Al2O3; atmospheric air; electrode materials; energy dispersive X-ray surface analysis; high current high energy switching; insulator; plasma arc environments; surface discharge switch; Ceramics; Composite materials; Conducting materials; Copper; Electrodes; Insulation; Plasma measurements; Surface contamination; Surface discharges; Switches;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.22522
  • Filename
    22522