• DocumentCode
    926248
  • Title

    The Einstein relation

  • Author

    Landsberg, P.T.

  • Volume
    61
  • Issue
    4
  • fYear
    1973
  • fDate
    4/1/1973 12:00:00 AM
  • Firstpage
    476
  • Lastpage
    476
  • Keywords
    Aluminum alloys; Copper; Degradation; Electromigration; Inorganic materials; Integrated circuit metallization; Semiconductor films; Silicon alloys; Silicon devices; Temperature;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1973.9070
  • Filename
    1451000