DocumentCode
926255
Title
Limitations on high-temperature processing of aluminum-copper metallization
Author
Learn, A.J.
Volume
61
Issue
4
fYear
1973
fDate
4/1/1973 12:00:00 AM
Firstpage
476
Lastpage
477
Abstract
Disruptive alteration of the structure of heat-treated aluminum-copper metallization either containing or contacting silicon is reported. Effects are attributed to eutectic formation in the aluminum-copper-silicon system. Processing temperatures less than 525°C are recommended for aluminum metallization containing copper.
Keywords
Aluminum alloys; Copper; Degradation; Electromigration; Inorganic materials; Integrated circuit metallization; Semiconductor films; Silicon alloys; Silicon devices; Temperature;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1973.9071
Filename
1451001
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