Title :
Compact high-impedance surfaces incorporated with interdigital structure
Author :
Fu, Y. ; Yuan, N. ; Zhang, G.
Author_Institution :
Sch. of Electron. Sci. & Eng., Nat. Univ. of Defense Technol., Changsha, China
fDate :
3/4/2004 12:00:00 AM
Abstract :
A novel compact high-impedance surface structure is presented. The periodic branched elements cross over like interdigital capacitors. This structure is adopted to increase the fringe capacitor in order to compress the overall size of the high-impedance surface. Measured results show that 30-40% size reduction could be obtained.
Keywords :
capacitors; microwave integrated circuits; surface impedance; compact high-impedance surfaces incorporation; fringe capacitor; interdigital capacitors; interdigital structure; microwave circuits; size reduction; surface structure;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20040225
