DocumentCode
927122
Title
Transducer bonding with primed anaerobic acrylate sealant
Author
Rosenberg, R.L.
Author_Institution
Bell Telephone Laboratories, Inc., Holmdel, USA
Volume
11
Issue
6
fYear
1975
Firstpage
127
Lastpage
128
Abstract
A technology with novel characteristics is described for bonding a transducer plate to a delay line. Experiments near 20 MHz show that the total insertion loss can be quite low for delay lines with acoustic apertures below 1 mm2.
Keywords
acoustic surface wave devices; adhesion; joining processes; piezoelectric transducers; ultrasonic delay lines; ultrasonic transducers; 20 MHz; US transducers; acoustic apertures; acoustic surface wave delay lines; bonding; primed anaerobic acrylate sealant;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19750096
Filename
4236607
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