Title :
Transducer bonding with primed anaerobic acrylate sealant
Author_Institution :
Bell Telephone Laboratories, Inc., Holmdel, USA
Abstract :
A technology with novel characteristics is described for bonding a transducer plate to a delay line. Experiments near 20 MHz show that the total insertion loss can be quite low for delay lines with acoustic apertures below 1 mm2.
Keywords :
acoustic surface wave devices; adhesion; joining processes; piezoelectric transducers; ultrasonic delay lines; ultrasonic transducers; 20 MHz; US transducers; acoustic apertures; acoustic surface wave delay lines; bonding; primed anaerobic acrylate sealant;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19750096
