DocumentCode :
927555
Title :
Ion implanted X-band IMPATT/TRAPATT back-to-back diodes
Author :
Fong, T.T. ; Ying, R.S. ; Lee, D.H.
Author_Institution :
Hughes Research Laboratories, Torrance, Calif.
Volume :
61
Issue :
7
fYear :
1973
fDate :
7/1/1973 12:00:00 AM
Firstpage :
1044
Lastpage :
1045
Abstract :
High-efficiency pulsed power at X-band frequencies has been generated using back-to-back IMPATT/TRAPATT silicon devices fabricated by ion implantation. Typical peak power of 8-12 W at 20-29-percent efficiency has been consistently achieved in a coaxial cavity. The highest power level obtained to date was 15-W peak, 21.5-percent efficiency at 8.1 GHz.
Keywords :
Avalanche breakdown; Boron; Circuits; Coaxial components; Diodes; Doping profiles; Epitaxial layers; Frequency; Pulse measurements; Silicon devices;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/PROC.1973.9198
Filename :
1451128
Link To Document :
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