• DocumentCode
    927688
  • Title

    Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects

  • Author

    Simpson, Jamesina J. ; Taflove, Allen ; Mix, Jason A. ; Heck, Howard

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
  • Volume
    54
  • Issue
    5
  • fYear
    2006
  • fDate
    5/1/2006 12:00:00 AM
  • Firstpage
    1983
  • Lastpage
    1990
  • Abstract
    This paper reports an experimental and computational study of substrate integrated waveguides (SIWs) optimized for use as ultrahigh-speed bandpass waveguiding digital interconnects. The novelty of this study resides in our successful design, fabrication, and testing of low-loss SIWs that achieve 100% relative bandwidths via optimal excitation of the dominant TE10 mode and avoidance of the excitation of the TE20 mode. Furthermore, our optimal structures maintain their 100% relative bandwidth while transmitting around 45° and 90° bends, and achieve measured crosstalk of better than -30 dB over the entire passband. We consider SIWs operating at center frequencies of 50 GHz, accommodating in principle data rates of greater than 50 Gb/s. These SIWs are 35% narrower in the transverse direction and provide a 20% larger relative bandwidth than our previously reported electromagnetic bandgap waveguiding digital interconnects. Since existing circuit-board technology permits dimensional reductions of the SIWs by yet another factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/s are feasible. These data rates meet or exceed those expected eventually for proposed silicon photonic technologies.
  • Keywords
    integrated circuit design; integrated circuit interconnections; integrated circuit testing; waveguide discontinuities; 200 Gbit/s; 50 GHz; bandpass waveguiding digital interconnects; circuit-board technology; electromagnetic bandgap; finite-difference time-domain; multiprocessor interconnection; substrate integrated waveguides; ultrahighspeed digital interconnects; waveguide bends; Bandwidth; Crosstalk; Electromagnetic waveguides; Fabrication; Frequency; Integrated circuit interconnections; Passband; Periodic structures; Tellurium; Testing; Finite-difference time-domain (FDTD) methods; multiprocessor interconnection; waveguide bends; waveguides;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2006.873622
  • Filename
    1629040