CAD equivalent-circuit modeling of attenuation and cross-coupling for edge-suspended coplanar waveguides on lossy silicon substrate

Author

Leung, Lydia L W ; Chen, Kevin J.

Author_Institution

Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China

Volume

54

Issue

5

fYear

2006

fDate

5/1/2006 12:00:00 AM

Firstpage

2249

Lastpage

2255

Abstract

In this paper, a compact computer-aided design (CAD)-oriented frequency-independent equivalent-circuit model, taking the skin effect, proximity effect, and substrate effect into consideration, is presented for the edge-suspended coplanar waveguide (ESCPW) on lossy silicon substrate. The ESCPWs exhibit the benefit of reduced loss, while avoid the reliability issues that are associated with the suspended coplanar waveguides. The model shows good agreement with the measured insertion loss and the extracted RLGC line parameters up to 25 GHz. With the model, the relationship between physical perimeters of the ESCPWs and the electrical characteristics is also investigated. Moreover, cross-coupling between adjacent ESCPWs with common ground is characterized and modeled.

Keywords

CAD; coplanar waveguides; equivalent circuits; micromachining; proximity effect (superconductivity); skin effect; sputter etching; substrates; 25 GHz; CAD equivalent-circuit modeling; cross-coupling; edge-suspended coplanar waveguide; inductively coupled plasma deep reactive ion etching; proximity effect; skin effect; substrate effect; Attenuation; Coplanar waveguides; Design automation; Electric variables; Frequency; Insertion loss; Loss measurement; Proximity effect; Silicon; Skin effect; Cross-coupling; edge-suspended coplanar waveguide (ESCPW); equivalent-circuit model; inductively coupled plasma deep reactive ion etching (ICP-DRIE); micromachining;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2006.873636

Filename

1629069