DocumentCode :
928007
Title :
CAD equivalent-circuit modeling of attenuation and cross-coupling for edge-suspended coplanar waveguides on lossy silicon substrate
Author :
Leung, Lydia L W ; Chen, Kevin J.
Author_Institution :
Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
Volume :
54
Issue :
5
fYear :
2006
fDate :
5/1/2006 12:00:00 AM
Firstpage :
2249
Lastpage :
2255
Abstract :
In this paper, a compact computer-aided design (CAD)-oriented frequency-independent equivalent-circuit model, taking the skin effect, proximity effect, and substrate effect into consideration, is presented for the edge-suspended coplanar waveguide (ESCPW) on lossy silicon substrate. The ESCPWs exhibit the benefit of reduced loss, while avoid the reliability issues that are associated with the suspended coplanar waveguides. The model shows good agreement with the measured insertion loss and the extracted RLGC line parameters up to 25 GHz. With the model, the relationship between physical perimeters of the ESCPWs and the electrical characteristics is also investigated. Moreover, cross-coupling between adjacent ESCPWs with common ground is characterized and modeled.
Keywords :
CAD; coplanar waveguides; equivalent circuits; micromachining; proximity effect (superconductivity); skin effect; sputter etching; substrates; 25 GHz; CAD equivalent-circuit modeling; cross-coupling; edge-suspended coplanar waveguide; inductively coupled plasma deep reactive ion etching; proximity effect; skin effect; substrate effect; Attenuation; Coplanar waveguides; Design automation; Electric variables; Frequency; Insertion loss; Loss measurement; Proximity effect; Silicon; Skin effect; Cross-coupling; edge-suspended coplanar waveguide (ESCPW); equivalent-circuit model; inductively coupled plasma deep reactive ion etching (ICP-DRIE); micromachining;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2006.873636
Filename :
1629069
Link To Document :
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