Title :
Recent applications of polyimide to micromachining technology
Author :
Frazier, A. Bruno
Author_Institution :
Dept. of Electr. Eng., Louisiana Tech. Univ., Ruston, LA, USA
fDate :
10/1/1995 12:00:00 AM
Abstract :
In this paper, applications of polyimide materials to micromachining technology are reviewed. First, the use of polyimide-based materials as sensor materials are discussed. In this case, the polyimide material is used as an integral part of the micromachined devices. Emphasis is given to the development and characterization of a piezoresistive composite of polyimide and graphite particles. The composite material is characterized for the mechanical properties (Young´s modulus, residual stress) and the electromechanical property (piezoresistive coefficient). Second, the use of both photosensitive and nonphotosensitive polyimides as electroplating molds for the fabrication of thick and high aspect ratio metallic microstructures is presented. Extensions of the basic micromolding process, which enable the fabrication of controlled gaps between metallic microstructural components and higher aspect ratio microstructures, are presented. Electroplated metallic microstructures realized using these technologies are shown. In addition, various applications of the polyimide micromolding technologies are discussed
Keywords :
Young´s modulus; composite materials; electroplating; internal stresses; micromachining; microsensors; piezoresistive devices; polymers; Young´s modulus; composite material; controlled gaps fabrication; electromechanical property; electroplating molds; fabrication; graphite particles; high aspect ratio metallic microstructures; mechanical properties; micromachining technology; nonphotosensitive polyimides; photosensitive polyimides; piezoresistive coefficient; piezoresistive composite; polyimide; residual stress; sensor materials; thick metallic microstructures; Composite materials; Fabrication; Mechanical factors; Mechanical sensors; Micromachining; Microstructure; Piezoresistance; Polyimides; Residual stresses; Sensor phenomena and characterization;
Journal_Title :
Industrial Electronics, IEEE Transactions on