Title :
Modeling and simulation of hot-carrier-induced device degradation in MOS circuits
Author :
Leblebici, Yusuf ; Kang, Sung-Mo
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fDate :
5/1/1993 12:00:00 AM
Abstract :
The physical models and an integrated simulation tool are presented for estimating the hot-carrier-induced degradation of nMOS transistor characteristics and circuit performance. The proposed reliability simulation tool incorporates an accurate one-dimensional MOSFET model for representing the electrical behavior of locally damaged transistors. The hot-carrier-induced oxide damage can be specified by only a few parameters, avoiding extensive parameter extractions for the characterization of device damage. The physical degradation model includes both fundamental device degradation mechanisms, i.e., charge trapping and interface trap generation. A repetitive simulation scheme has been adopted to ensure accurate prediction of the circuit-level degradation process under dynamic operating conditions
Keywords :
CMOS integrated circuits; MOS integrated circuits; circuit analysis computing; circuit reliability; digital simulation; electron traps; equivalent circuits; hot carriers; impact ionisation; interface electron states; semiconductor device models; semiconductor-insulator boundaries; MOS circuits; charge trapping; circuit performance; circuit-level degradation process; degradation model; dynamic operating conditions; electrical behavior; hot-carrier-induced device degradation; integrated simulation tool; interface trap generation; locally damaged transistors; nMOS transistor characteristics; one-dimensional MOSFET model; oxide damage; physical models; reliability simulation; Circuit optimization; Circuit simulation; Computational modeling; Degradation; Hot carriers; Integrated circuit reliability; Life estimation; Lifetime estimation; MOSFET circuits; Very large scale integration;
Journal_Title :
Solid-State Circuits, IEEE Journal of