• DocumentCode
    929166
  • Title

    An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances

  • Author

    Wang, Chen ; Mao, Jingkun ; Selli, Giuseppe ; Luan, Shaofeng ; Zhang, Lin ; Fan, Jun ; Pommerenke, David J. ; Dubroff, Richard E. ; Drewniak, James L.

  • Author_Institution
    Nvidia Corp., Santa Clara, CA, USA
  • Volume
    29
  • Issue
    2
  • fYear
    2006
  • fDate
    5/1/2006 12:00:00 AM
  • Firstpage
    320
  • Lastpage
    334
  • Abstract
    Investigation of a dc power delivery network, consisting of a multilayer PCB using area fills for power and return, involves the distributed behavior of the power/ground planes and the parasitics associated with the lumped components mounted on it. Full-wave methods are often employed to study the power integrity problem. While full-wave methods can be accurate, they are time and memory consuming. The cavity model of a rectangular structure has previously been employed to efficiently analyze the simultaneous switching noise (SSN) in the power distribution network. However, a large number of modes in the cavity model are needed to accurately simulate the impedance associated with the vias, leading to computational inefficiency. A fast approach is detailed herein to accelerate calculation of the summation associated with the higher-order modes. Closed-form expressions for the parasitics associated with the interconnects of the decoupling capacitors are also introduced. Combining the fast calculation of the cavity models of regularly shaped planar circuits, a segmentation method, and closed-form expressions for the parasitics, an efficient approach is proposed herein to analyze an arbitrary shaped power distribution network. While it may take many hours for a full-wave method to do a single simulation, the proposed method can generally perform the simulation with good accuracy in several minutes. Another advantage of the proposed method is that a SPICE equivalent circuit of the power distribution network can be derived. This allows both frequency and transient responses to be done with SPICE simulation.
  • Keywords
    distribution networks; equivalent circuits; inductance; integrated circuit interconnections; power supply circuits; SPICE equivalent circuit; SPICE simulation; SSN; cavity models; closed-form expressions; dc power delivery network; decoupling capacitors; full-wave methods; multilayer PCB; parasitic interconnect inductances; planar circuits; power delivery network design; power distribution network; power integrity problem; power/ground planes; segmentation method; simultaneous switching noise; transient responses; Acceleration; Capacitors; Circuit simulation; Closed-form solution; Computational modeling; Impedance; Integrated circuit interconnections; Nonhomogeneous media; Power systems; SPICE; Cavity resonators; circuit modeling; inductance; power distribution;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2006.871202
  • Filename
    1629175