Title :
Semiconductor reliability within the U. S. department of defense
Author_Institution :
Griffiss Air Force Base, Rome, N. Y.
Abstract :
This paper describes the standardization and specification approach used by the U. S. Department of Defense (DOD) to procure reliable semiconductor devices. A brief discussion of the background and rationale leading up to the present approach, and some of the experience upon which it was based, is presented. Related reliability studies and other activities necessary to assure effective implementation of this approach are summarized. The emphasis in the discussion of these studies is on identification of failure modes and mechanisms and the use of this information in device specification, qualification, reliability testing, and reliability prediction. Major consideration is given to microelectronic-device reliability problems.
Keywords :
Circuit testing; Electronics packaging; Integrated circuit reliability; Integrated circuit technology; Monolithic integrated circuits; Qualifications; Semiconductor device reliability; Semiconductor devices; Standardization; US Department of Defense;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/PROC.1974.9407