DocumentCode
929873
Title
Reliability assurance of individual semiconductor components
Author
Haythornthwaite, Raymond F. ; Molozzi, Andrew R. ; Sulway, David Vernon
Author_Institution
Communications Research Center, Ottawa, Ont., Canada
Volume
62
Issue
2
fYear
1974
Firstpage
260
Lastpage
273
Abstract
Where small numbers of highly reliable semiconductor devices are required, conventional methods of procurement are found to have deficiencies. An approach to procurement is proposed which is cost effective, accommodates new device types, and assures reliability in the individual device. Although principally applied to silicon planar transistors, the approach can be extended to other semiconductor types. A critical evaluation is made of the manufacturer and his technology. The devices obtained from each diffused wafer are grouped into separate lots. Selected tests are performed on these lots in order to discover possible failure mechanisms. Tests may involve simple electrical measurements or detailed techniques such as scanning electron microscopy and X-ray microprobe analysis. The Canadian/U.S.A. Communications Technology Satellite (CTS) program has adopted this procurement procedure.
Keywords
Costs; Electric variables measurement; Failure analysis; Performance evaluation; Procurement; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor devices; Silicon; Testing;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1974.9413
Filename
1451343
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