On the edge-thermal resistance (ICs)

Thermal characteristics of integrated circuits (ICs) have long been a major concern for both manufacturers and users of electronic products. An increase in junction temperature can adversely affect the long-term performance and operating life of an IC. Several variables affect junction temperature. The IC vendor controls some of these; the user and the environment in which the device is operated control others. With the continuing trend toward denser and more complex circuits and a growing number of pins, total power dissipation is increasing. Hence management of thermal characteristics remains a valid concern. Heat transfer processes are reviewed, and various methods available for predicting die temperature are discussed.<>