DocumentCode :
932175
Title :
Failure modes and mechanisms for VLSI ICs¿a review
Author :
Fantini, F. ; Morandi, C.
Author_Institution :
Telettra S.p.A., Reliability & Quality Department, Bologna, Italy
Volume :
132
Issue :
3
fYear :
1985
fDate :
6/1/1985 12:00:00 AM
Firstpage :
74
Lastpage :
81
Abstract :
Knowledge of the electrical failure modes and of the physical mechanisms that cause faults is fundamental to implementing realistic fault models. Therefore, failure physics is the basis of effectual test sequence generation, and can give guidelines also for the design of testable and reliable integrated circuits. In the paper the failure modes and mechanisms of complex integrated circuits are reviewed. Faults are classified with respect to their allocation in the devices. Bulk defects, and failures in the dielectric layers, metallisation and package interconnections are then examined. Special attention is devoted to failures spurred by the reduction of dimensions for VLSI (`scaling¿)
Keywords :
VLSI; electrical faults; failure analysis; integrated circuit technology; monolithic integrated circuits; reviews; VLSI ICs; bulk defects; dielectric layers; dimensions reduction; electrical failure modes; fault models; integrated circuits; metallisation; monolithic IC; package interconnections; physical mechanisms; review; scaling;
fLanguage :
English
Journal_Title :
Electronic Circuits and Systems, IEE Proceedings G
Publisher :
iet
ISSN :
0143-7089
Type :
jour
DOI :
10.1049/ip-g-1:19850018
Filename :
4646466
Link To Document :
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