A novel MONOS-type nonvolatile memory using high-κ dielectrics for improved data retention and programming speed

This paper presents a novel metal-oxide-nitride-oxide-silicon (MONOS)-type nonvolatile memory structure using hafnium oxide (HfO₂) as tunneling and blocking layer and tantalum pentoxide (Ta₂O₅) as the charge trapping layer. The superiorities of such devices to traditional SiO₂-Si₃N₄-SiO₂ stack devices in obtaining a better tradeoff between faster programming and better retention are illustrated based on a band engineering analysis. The experimental results demonstrate that the fabricated devices can be programmed as fast as 1 μs and erased from 10 ns at an 8-V gate bias. The retention decay rate of this device is improved by a factor more than three as compared to the conventional MONOS/SONOS type devices. Excellent endurance and read disturb performance are also demonstrated.