DocumentCode
934879
Title
Destruction of gaseous pollutants by surface-induced plasma chemical process (SPCS)
Author
Masuda, Senichi ; Hosokawa, Shunsuke ; Tu, Xiang-Ling ; Sakakibara, Kaichi ; Kitoh, Shigehiro ; Sakai, Shigeo
Author_Institution
Fukui Inst. of Technol., Tokyo, Japan
Volume
29
Issue
4
fYear
1993
Firstpage
781
Lastpage
786
Abstract
The surface discharge-induced plasma chemical process (SPCP) has great advantages in the destruction of various gaseous pollutants (NO x, SOx, CO, Freons, etc.), air toxicants (Hg vapor, hazardous solvent vapors, etc.), and odors because of its unique features: a very strong decomposition capability for stable contaminant gases, its compact size, and its low cost. A ceramic-made reactor is used for generation of high-frequency surface discharge to produce a planar plasma region over its surface. The gas containing pollutants is contacted in this region and exposed to copious radicals (OH, O, O3 , N, NH2, NH, H, etc.) to be decomposed of or oxidized. This process has a very wide application range: from diesel engines, industrial furnaces, incinerators, and food processors to larger industrial boilers. The first application of SPCP was extremely small ozonizers with very high performance, but a number of new application fields are being developed
Keywords
electrostatic devices; high-frequency discharges; plasma applications; plasma devices; safety; surface discharges; CO; Freons; HF; Hg vapor; NOx; SOx; application; chemical variable control; decomposition; diesel engines; electrostatic devices; food processors; gaseous pollutants; hazardous solvent vapors; incinerators; industrial boilers; industrial furnaces; oxidation; ozonizers; performance; radicals; reactor; safety; surface discharge-induced plasma chemical process; Air pollution; Chemical processes; Costs; Food industry; Gases; Mercury (metals); Plasma chemistry; Solvents; Surface contamination; Surface discharges;
fLanguage
English
Journal_Title
Industry Applications, IEEE Transactions on
Publisher
ieee
ISSN
0093-9994
Type
jour
DOI
10.1109/28.231994
Filename
231994
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