Title :
FSA SiP Market and Patent Analysis Report
Author :
FSA SiP Subcommittee
Abstract :
This paper provides an in-depth introduction and analysis on system-in-package (SiP) technology by discussing SiP market perspectives and related SiP patent issues.
Keywords :
patents; system-in-package; SiP market; SiP patent analysis; system-in-package technology; CMOS process; CMOS technology; Components, packaging, and manufacturing technology; Costs; Electronics packaging; Integrated circuit interconnections; Packaging machines; Production; Random access memory; Semiconductor device packaging; SiP; SiP market; SoC; packaging; patent analysis; system in package;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2007.44
