Title :
Mechanical design considerations for area array solder joints
Author :
Børgesen, Peter ; Li, Che-Yu ; Conway, H.D.
Author_Institution :
Cornell Univ., Ithaca, NY, USA
fDate :
5/1/1993 12:00:00 AM
Abstract :
Concurrent engineering often requires mechanical reliability to be traded off against a number of other criteria. Rather than simple optimization, mechanical design usually relies, explicitly or implicitly, on the assessment of the relative merits of a number of alternatives. However, the evaluation of a large number of designs by finite element and damage integral methods would, at best, be extremely cumbersome. The present work describes design tools based on elastic stress analysis for rapid assessment of area array assembly designs in terms of mechanical reliability. Examples in the discussion illustrate various means of improving the reliability of such assemblies
Keywords :
circuit reliability; concurrent engineering; flip-chip devices; packaging; soldering; stress analysis; area array solder joints; concurrent engineering; design tools; elastic stress analysis; flip-chip; mechanical design; mechanical reliability; packaging; rapid assessment; Assembly; Costs; Electronic packaging thermal management; Finite element methods; Lead; Plastics; Reliability engineering; Soldering; Stress; Substrates;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on