DocumentCode
935267
Title
Mechanical design considerations for area array solder joints
Author
Børgesen, Peter ; Li, Che-Yu ; Conway, H.D.
Author_Institution
Cornell Univ., Ithaca, NY, USA
Volume
16
Issue
3
fYear
1993
fDate
5/1/1993 12:00:00 AM
Firstpage
272
Lastpage
283
Abstract
Concurrent engineering often requires mechanical reliability to be traded off against a number of other criteria. Rather than simple optimization, mechanical design usually relies, explicitly or implicitly, on the assessment of the relative merits of a number of alternatives. However, the evaluation of a large number of designs by finite element and damage integral methods would, at best, be extremely cumbersome. The present work describes design tools based on elastic stress analysis for rapid assessment of area array assembly designs in terms of mechanical reliability. Examples in the discussion illustrate various means of improving the reliability of such assemblies
Keywords
circuit reliability; concurrent engineering; flip-chip devices; packaging; soldering; stress analysis; area array solder joints; concurrent engineering; design tools; elastic stress analysis; flip-chip; mechanical design; mechanical reliability; packaging; rapid assessment; Assembly; Costs; Electronic packaging thermal management; Finite element methods; Lead; Plastics; Reliability engineering; Soldering; Stress; Substrates;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.232053
Filename
232053
Link To Document