• DocumentCode
    935267
  • Title

    Mechanical design considerations for area array solder joints

  • Author

    Børgesen, Peter ; Li, Che-Yu ; Conway, H.D.

  • Author_Institution
    Cornell Univ., Ithaca, NY, USA
  • Volume
    16
  • Issue
    3
  • fYear
    1993
  • fDate
    5/1/1993 12:00:00 AM
  • Firstpage
    272
  • Lastpage
    283
  • Abstract
    Concurrent engineering often requires mechanical reliability to be traded off against a number of other criteria. Rather than simple optimization, mechanical design usually relies, explicitly or implicitly, on the assessment of the relative merits of a number of alternatives. However, the evaluation of a large number of designs by finite element and damage integral methods would, at best, be extremely cumbersome. The present work describes design tools based on elastic stress analysis for rapid assessment of area array assembly designs in terms of mechanical reliability. Examples in the discussion illustrate various means of improving the reliability of such assemblies
  • Keywords
    circuit reliability; concurrent engineering; flip-chip devices; packaging; soldering; stress analysis; area array solder joints; concurrent engineering; design tools; elastic stress analysis; flip-chip; mechanical design; mechanical reliability; packaging; rapid assessment; Assembly; Costs; Electronic packaging thermal management; Finite element methods; Lead; Plastics; Reliability engineering; Soldering; Stress; Substrates;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.232053
  • Filename
    232053