Title :
The reliability of OLB joints of gold-plated TAB leads
Author :
Schmitt-Thomas, Karlheinz G. ; Groll, Manfred ; Mödl, Albert
Author_Institution :
Lehrstuhl fuer Werkstoffe im Maschinenbau, Tech. Univ., Munchen, Germany
fDate :
5/1/1993 12:00:00 AM
Abstract :
The reliability of outer lead bonding (OLB) joints of gold-plated tape automated bonding (TAB) leads after hot bar soldering is investigated. The consequences of thermal aging at elevated temperatures on the solid-state diffusion reactions are studied. The activation energy for the growth of the ternary CuAuSn intermetallic compound is determined to be 0.47 eV. Both aging and thermoshock treatment cause an embrittlement of the solder joint without substantially weakening the mechanical strength, even at severe test conditions
Keywords :
chemical interdiffusion; circuit reliability; embrittlement; soldering; tape automated bonding; thermal shock; Au plated leads; CuAuSn intermetallic growth; TAB leads; The activation energy; conductor-solder interface; embrittlement; hot bar soldering; outer lead bonding joints; reliability; solder joint; solid-state diffusion reactions; thermal aging; thermoshock; Aging; Bonding forces; Conductors; Diffusion bonding; Gold; Intermetallic; Lead; Soldering; Solid state circuits; Temperature;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
