The reliability of OLB joints of gold-plated TAB leads

Author

Schmitt-Thomas, Karlheinz G. ; Groll, Manfred ; Mödl, Albert

Author_Institution

Lehrstuhl fuer Werkstoffe im Maschinenbau, Tech. Univ., Munchen, Germany

Volume

16

Issue

3

fYear

1993

fDate

5/1/1993 12:00:00 AM

Firstpage

284

Lastpage

291

Abstract

The reliability of outer lead bonding (OLB) joints of gold-plated tape automated bonding (TAB) leads after hot bar soldering is investigated. The consequences of thermal aging at elevated temperatures on the solid-state diffusion reactions are studied. The activation energy for the growth of the ternary CuAuSn intermetallic compound is determined to be 0.47 eV. Both aging and thermoshock treatment cause an embrittlement of the solder joint without substantially weakening the mechanical strength, even at severe test conditions

Keywords

chemical interdiffusion; circuit reliability; embrittlement; soldering; tape automated bonding; thermal shock; Au plated leads; CuAuSn intermetallic growth; TAB leads; The activation energy; conductor-solder interface; embrittlement; hot bar soldering; outer lead bonding joints; reliability; solder joint; solid-state diffusion reactions; thermal aging; thermoshock; Aging; Bonding forces; Conductors; Diffusion bonding; Gold; Intermetallic; Lead; Soldering; Solid state circuits; Temperature;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.232054

Filename

232054