Title :
A new de-embedding technique for on-board structures applied to the bandwidth measurement of packages
Author :
Van Hauwermeiren, Luc ; Botte, Marnix ; De Zutter, Daniël
Author_Institution :
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
fDate :
5/1/1993 12:00:00 AM
Abstract :
A de-embedding technique for on board structures or devices under tests (DUTs) is presented. The key feature of the method is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. The technique also uses the time-domain option of modern network analyzers. The approach is illustrated by detailed bandwidth measurements for a high pin count package
Keywords :
S-parameters; circuit analysis computing; packaging; printed circuit testing; time-domain analysis; S-parameter data; bandwidth measurement; de-embedding technique; devices under tests; high pin count package; network analyzers; on-board structures; time-domain option; Acoustic testing; Bandwidth; Circuits; Coaxial components; Impedance; Microstrip; Packaging; Scattering parameters; Semiconductor device measurement; Time domain analysis;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
