Title :
Corrosion of thin film aluminum metallization: conformal coating materials
Author :
Osenbach, J.S. ; Zell, J.L.
Author_Institution :
AT&T Bell Lab., Allentown, PA, USA
fDate :
5/1/1993 12:00:00 AM
Abstract :
The authors report their results on the THB performance of triple-track-tester (TTT) devices coated with room temperature vulcanized silicon rubber (RTV), silicon resin, silicon polyimide, or silicon gel. Devices with each of these conformal coating materials were aged at 85 C/85% relative humidity (RH)/A, where 40→400 V, for times up to 14000 h. It is found that the median time-to-fail is exponentially related to the applied voltage. The median life at 300 V is in excess of 30000 h for the silicon-gel-coated samples. 10000 h for the RTV-coated samples, 3000 h for the silicon-resin-coated samples, and 2000 h for the polyimide-coated samples. The difference in the median life times is due to differences in the interface bond strength between the polymer coat and the device surface
Keywords :
aluminium; circuit reliability; corrosion; corrosion protective coatings; encapsulation; life testing; metallisation; packaging; Al; THB performance; applied voltage; conformal coating materials; corrosion; encapsulation; interface bond strength; median life; median time-to-fail; plastic packages; room temperature vulcanized silicon rubber; silicon gel; silicon polyimide; silicon resin; thin film Al metallisation; triple-track-tester devices; Aluminum; Coatings; Corrosion; Metallization; Polyimides; Resins; Rubber; Silicon; Temperature; Transistors;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on