• DocumentCode
    936213
  • Title

    H-polarization diffraction by a thick metal-dielectric join

  • Author

    Volakis, John L. ; Ricoy, Mark A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    37
  • Issue
    11
  • fYear
    1989
  • fDate
    11/1/1989 12:00:00 AM
  • Firstpage
    1453
  • Lastpage
    1462
  • Abstract
    An analysis is presented of the H-polarization diffraction due to a material discontinuity formed by the junction of a thick dielectric half-plane with a metallic half-plane having the same thickness. This is accomplished by first considering the solution of several subproblems. These include the direct diffraction and coupling due to a plane wave incident on a loaded open-ended parallel plate waveguide and radiation and reflection by a waveguide mode. The final solution for diffraction by the metal-dielectric join is obtained by introducing a perfectly conducting stub within the loaded guide and subsequently using the generalized scattering matrix formulation with the stub brought to the waveguide opening. All the analysis relating to the subproblems is done by the dual integral equation approach. As expected, the final expressions involve several Wiener-Hopf split functions which are evaluated numerically or analytically
  • Keywords
    electromagnetic wave diffraction; electromagnetic wave polarisation; integral equations; waveguide theory; H-polarization diffraction; Wiener-Hopf split functions; coupling; electromagnetic waves; generalized scattering matrix; integral equation; loaded open-ended parallel plate waveguide; material discontinuity; metal-dielectric join; radiation; reflection; waveguide mode; Conducting materials; Dielectric materials; Diffraction; Electromagnetic scattering; Electromagnetic waveguides; Geometry; Inorganic materials; Joining materials; Planar waveguides; Slabs;
  • fLanguage
    English
  • Journal_Title
    Antennas and Propagation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-926X
  • Type

    jour

  • DOI
    10.1109/8.43565
  • Filename
    43565