Title :
High-resolution AMI technique for evaluation of microelectronic packages
Author :
Zhang, G.-M. ; Harvey, D.M. ; Braden, D.R.
Author_Institution :
Eng. Dev. Centre, Liverpool John Moores Univ., UK
fDate :
3/18/2004 12:00:00 AM
Abstract :
An acoustic micro-imaging (AMI) technique for the evaluation of microelectronic packages and populated circuit boards is proposed. The technique is based on the concepts of sparse signal representation in overcomplete time-frequency dictionaries. The experimental results demonstrate its superior ability to conventional AMI techniques.
Keywords :
acoustic imaging; acoustic signal processing; echo; integrated circuit packaging; monolithic integrated circuits; time-frequency analysis; acoustic microimaging; circuit boards; echo; microelectronic packages; sparse signal; time-frequency analysis; ultrasonic signal;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20040267
