SPICE simulation used to characterize the cross-talk reduction effect of additional tracks grounded with vias on printed circuit boards

In analog and digital electronic systems, cross-talk between tracks on a printed circuit board can degrade the performance of equipment operations. A technique based on additional tracks grounded by vias, with which the cross-talk can be reduced by 50-90%, is presented. The circuit analysis code SPICE is used to analyze a lumped-circuit Tee structure model of three coupled lines. The via discontinuities are modeled in a novel way, which accounts for their transient skin-effect resistance. Both the cross-talk model and the cross-talk reduction technique are validated with measured results for signals of 50-1000 MHz, and risetimes of 5 ns. It is also shown how the far-field radiation from the circuit board is reduced with the introduction of additional grounded tracks