DocumentCode :
938718
Title :
Discussion on "Can water cause brittle fracture failures of non-ceramic insulators in the absence of electric field" [and reply]
Author :
Gorur, R. ; Mobasher, Bamshad ; Kumosa, M. ; Kumosa, L.
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Volume :
12
Issue :
3
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
621
Lastpage :
626
Abstract :
For original article by M. Kumosa, L. Kumosa and D. Armentrout see ibid., vol.11, no.3, p.523-33, June 2004. The authors of the Discussion point out, by considering referenced documents, that the process of degradation of E-glass composites with certain flaws under high humidity conditions has been thoroughly documented. Flexural test is perhaps the most common test conducted for a variety of materials including ceramics, composites, and both ductile and brittle materials. This is a simple test to set up and present the basic material property data. They believe that their test methodology for stress corrosion cracking (SCC) using a flexural set up is a viable, economical, and easily conducted test to ascertain the response of rods subjected to sustained loading. The original authors reply, agreeing that the test mentioned in the Discussion is "simple, economical, and easy to conduct". At the same time, they entirely disagree that the test is accurate and suitable for the stress corrosion testing of composite insulators.
Keywords :
brittle fracture; composite insulators; epoxy insulators; insulator testing; stress corrosion cracking; water; E-glass epoxy composites; brittle fracture failures; composite insulators; degradation process; flexural test; high humidity conditions; nonceramic insulators; strain capacity; stress corrosion cracking; stress corrosion testing; water; Ceramics; Composite materials; Conducting materials; Corrosion; Degradation; Dielectrics and electrical insulation; Humidity; Insulator testing; Materials testing; Stress;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2005.1453468
Filename :
1453468
Link To Document :
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