DocumentCode
939149
Title
The Need for a SiP Design and Test Infrastructure
Author
Kwang-Ting Cheng
Author_Institution
University of California, Santa Barbara
Volume
23
Issue
3
fYear
2006
Firstpage
181
Lastpage
181
Abstract
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
Keywords
SiP; system in package; Design automation; Testing; SiP; system in package;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2006.83
Filename
1634283
Link To Document