Title :
The Need for a SiP Design and Test Infrastructure
Author :
Kwang-Ting Cheng
Author_Institution :
University of California, Santa Barbara
Abstract :
Although successful and profitable applications have proven themselves in several market segments, significant challenges in system-in-package design and test remain for broader adoption.
Keywords :
SiP; system in package; Design automation; Testing; SiP; system in package;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2006.83
