DocumentCode
939207
Title
Cell phone integration: SiP, SoC, and PoP
Author
Rickert, Peter ; Krenik, William
Volume
23
Issue
3
fYear
2006
Firstpage
188
Lastpage
195
Abstract
Engineers must make many cost-effective decisions during a product´s design cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, and package-on-package integration for mobile phone applications
Keywords
mobile radio; system-in-package; system-on-chip; cost-effective decision; mobile phone application; package-on-package integration; product design cycle; system-in-package; system-on-chip; Bandwidth; Cellular phones; Costs; Energy management; GSM; Leakage current; Multiaccess communication; Packaging; Random access memory; Variable structure systems; PiP; PoP; RF integration; SiP; SoC; analog integration; memory integration;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2006.64
Filename
1634287
Link To Document