Title :
Cell phone integration: SiP, SoC, and PoP
Author :
Rickert, Peter ; Krenik, William
Abstract :
Engineers must make many cost-effective decisions during a product´s design cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, and package-on-package integration for mobile phone applications
Keywords :
mobile radio; system-in-package; system-on-chip; cost-effective decision; mobile phone application; package-on-package integration; product design cycle; system-in-package; system-on-chip; Bandwidth; Cellular phones; Costs; Energy management; GSM; Leakage current; Multiaccess communication; Packaging; Random access memory; Variable structure systems; PiP; PoP; RF integration; SiP; SoC; analog integration; memory integration;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2006.64
