Title :
Chip-package codesign flow for mixed-signal SiP designs
Author :
Brandtner, Thomas
Author_Institution :
Infineon Technol., Villach
Abstract :
Design engineers are challenged with two separate entities: the chip and package designs. Because system-in-package integrates multiple dies into a package, design engineers should have a tool to easily combine the two entities. This article demonstrates a seven-die SiP design that implements a chip-and-package codesign platform using available EDA tools
Keywords :
electronic design automation; hardware-software codesign; integrated circuit design; mixed analogue-digital integrated circuits; system-in-package; EDA tool; chip-package codesign flow; electronic design automation; mixed-signal system-in-package design; Chip scale packaging; Circuits; Databases; Design engineering; Dies; Electronic design automation and methodology; Environmental management; Hardware design languages; Logic design; Software tools; Mixed-Signal System-in-Package design; SiP;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2006.65
