DocumentCode
939261
Title
Electronic system, platform, and package codesign
Author
Madisetti, Vijay K.
Author_Institution
Electr. & Comput. Eng., Georgia Inst. of Technol.
Volume
23
Issue
3
fYear
2006
Firstpage
220
Lastpage
233
Abstract
Integrating multicore heterogeneous systems into a system-in-package has challenged many design and test engineers. To overcome these obstacles, we need a common EDA tool for digital, analog, RF, and thermal designs. This article proposes a platform-centric design methodology for modern electronic systems that could incorporate system-on-chip, system-in-package, and system-on-package technologies
Keywords
electronic design automation; integrated circuit design; system-in-package; system-on-chip; EDA tool; RF design; analog design; digital design; electronic system; multicore heterogeneous system integration; package codesign; system-in-package; system-on-chip; system-on-package; thermal design; Asynchronous transfer mode; Electronic packaging thermal management; Electronics packaging; GSM; Media Access Protocol; Multiaccess communication; Multicore processing; Quality of service; Radio frequency; System-on-a-chip; Electronic Packaging; Platform-Based Design; System-Level Design Automation; System-in-Package; System-on-Chip; System-on-Package;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2006.67
Filename
1634291
Link To Document