DocumentCode :
939404
Title :
Is System in Package the Panacea for Integration?
Author :
Mak, T.M.
Author_Institution :
Intel
Volume :
23
Issue :
3
fYear :
2006
Firstpage :
256
Lastpage :
256
Abstract :
With technology scaling, nature has not been kind to conventional analog circuit design. System in package seems the obvious way to go. But its predecessor was the multichip module, and basically, all the problems are still there. The author discusses where to go from here.
Keywords :
SiP; System in Package; integration; Packaging; Testing; SiP; System in Package; integration;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2006.76
Filename :
1634302
Link To Document :
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