Title :
New Closed-Form Formula for Series Inductance and Shunt Capacitance Based on Measured TDR Impedance Profile
Author :
Zeng, Xiangyin ; He, Jiangqi ; Wang, Mingchang ; Abdulla, Mostafa
Author_Institution :
Intel Technol. Dev. Ltd., Shanghai
Abstract :
Time domain reflectometry has been widely used to characterize high speed interconnects. The equivalent lumped LC model is then developed based on the measured impedance profile (Z-profile). However, for discrete L or C, mounted in the middle of transmission line interconnects, the current formula based on Z-profile cannot provide correct results. In this letter, a new closed-form formula based on the Z-profile is derived to determine the lumped L or C with the rise time of the incident step taken into account, which is easy to integrate into any EDA tools.
Keywords :
equivalent circuits; integrated circuit interconnections; time-domain reflectometry; transmission lines; EDA tools; TDR impedance profile; closed-form formula; equivalent lumped LC model; high speed interconnect characteristics; series inductance; shunt capacitance; time domain reflectometry; transmission line interconnects; Capacitance; inductance; time domain reflectometry (TDR);
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2007.908048
