DocumentCode :
939505
Title :
60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects
Author :
Wu, Wei-Cheng ; Hsu, Li-Han ; Chang, Edward Yi ; Kärnfelt, Camilla ; Zirath, Herbert ; Starski, J. Piotr ; Wu, Yun-Chi
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu
Volume :
17
Issue :
11
fYear :
2007
Firstpage :
784
Lastpage :
786
Abstract :
In this letter, the microstrip-to-coplanar waveguide (MS-to-CPW) hot-via flip chip interconnect has been experimentally demonstrated to have broadband performance from dc to 67 GHz. The interconnect structures with the hot-via transitions were first designed and optimized by using the electromagnetic simulation tool. Three types of designs were investigated in this letter. The interconnect structures were then fabricated and radio frequency (RF) tested up to 67GHz. The optimized interconnect structure with the compensation design demonstrated excellent RF characteristics with the insertion loss less than 0.5dB and the return loss below 18dB over a very broad bandwidth from dc to 67GHz. This is to our knowledge the best result reported for this frequency range.
Keywords :
coplanar waveguides; flip-chip devices; microstrip circuits; millimetre wave circuits; broadband MS-to-CPW interconnects; broadband performance; electromagnetic simulation tool; frequency 60 GHz; hot-via flip chip interconnects; microstrip-to-coplanar waveguide; Coplanar waveguide (CPW); finite ground coplanar (FGC) waveguide; flip chip; hot-via; interconnect; microstrip (MS);
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2007.908053
Filename :
4357997
Link To Document :
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