DocumentCode
939976
Title
Measurement of Surface Tension of Epoxy Resins Used in Dispensing Process for Manufacturing Thin Film Transistor-Liquid Crystal Displays
Author
Cheng, Chin-Hsiang ; Lin, Hung-Hsiang
Author_Institution
Nat. Cheng Kung Univ., Tainan
Volume
31
Issue
1
fYear
2008
Firstpage
100
Lastpage
106
Abstract
This paper presents an inverse method for measuring the surface tension of the epoxy resins used in the dispensing process for manufacturing TFT-LCD based on droplet images. A direct method, which is capable of predicting the profile of an axisymmetric liquid droplet, is developed, and then the direct method is incorporated with a droplet imaging system to build up a measurement system for determination of the surface tension of the epoxy resins. When applying the surface tension measurement method, one only needs to give the density of the liquid and identify the geometric parameters of the liquid droplet, such as the droplet volume and the contact angle, through the imaging system. This approach has been used to determine surface tension of various epoxy resins. Finally, for testing the accuracy of the approach, some commonly used fluids are tested. Results show that the approach leads to satisfactory accuracy.
Keywords
drops; electron device manufacture; liquid crystal displays; polymers; surface tension measurement; thin film transistors; axisymmetric liquid droplet; contact angle; dispensing process; droplet imaging system; droplet volume; epoxy resin; geometric parameter; inverse method; surface tension measurement; thin film transistor-liquid crystal display; Dispensing process; epoxy resins; imaging method; surface tension; thin film transistor-liquid crystal displays (TFT-LCDs);
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2007.901767
Filename
4358044
Link To Document